Packaging education shifting emphasis

Packaging education is undergoing a change, with more attention being given to the machines and the underlying technologies that support them. A rapidly expanding emphasis on mechatronics is causing schools and organizations to add, modify and rename programs. Expect to see new players, new programs and some significant educational announcements at PackExpo 2008.

Most packaging education programs have been about package design and packaging materials, with little emphasis on the technologies specifically supporting packaging machinery. Packaging machinery education was relegated to conventional mechanical engineering programs and a few community college programs such as those at Alex Tech and Wisconsin Indianhead. That is changing.

With the interdisciplinary area of mechatronics driving advances in packaging machinery, schools, with the encouragement of industry and workforce development agencies, are creating programs that specifically address the needs of packaging machinery design, maintenance and operations support. Trade organizations such as PMMI and the International Fluid Power Society are exploring new programs in mechatronics while other organizations are increasing emphasis on mechatronics. For example, the Center for Automation and Motion Control at Alex Tech has recently changed its name to the Center for Applied Mechatronics. Siemens University in Berlin has created an international certification program in mechatronics which is being rolled out in the US in cooperation with the Kentucky Community & Technical College System.

The Mid-Atlantic region of the US is rich in consumer packaged goods manufacturing, and as a result, the Mid-Atlantic Mechatronics Partnership has established an advisory council to work with schools in the region that already offer mechatronics programs and to encourage additional schools to do the same. This Advisory Council is working with PMMI and schools from around the country to establish national skill certificates in packaging-oriented mechatronics. A meeting of these groups was held over the summer at Purdue University and a follow-up meeting is planned during PackExpo.

Reading Area Community College from Reading, PA will be a new exhibitor in the education pavilion at PMMI where they will highlight their AAS Degree in Mechatronics Engineering Technology which carries a packaging emphasis. Watch for announcements during the show of formally established articulation agreements that allow high school students, community college students, incumbent workers and university students to carry their credits in mechatronics from school to school without having to repeat already-completed course work.

If you want to get some ideas about how to take advantage of these new training and education programs or to get some ideas on how to get some going in your area, attend the PackExpo 08 conference session at 8:30 on Tuesday morning in S103B/C entitled "Developing the Packaging Workforce of the Future". Yours truly will be participating along with representatives of education and workforce development to share ideas and experiences. Hope to see you there!

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