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Scouting PackExpo 2008
September 18, 2008
It will soon be time to jet off to Chicago for this year's installment of PackExpo. One hopes that every show of this size brings something new or exciting to the industry. This year's PackExpo should be no exception. Here are some things that I plan to be scouting for.
Robots
Given the number of robots on display at Interpack, I expect to see robots everywhere at PackExpo. Everyone is going to want to be connected somehow to robotics, either with product offerings, alliances, components or accessories. You may find yourself saying, "oh, not another booth with a robot! " With the huge increase in interest since just last year, I would test carefully claims of capability and experience.
In addition to the typical players in this market such as ABB and Fanuc, be on the lookout for new entries in what I have called 'purpose-built robotics'. Expect to see lots of 2 axis and some 3 or more axis motions implemented using robotic components such as Bosch Rexroth's camoLINE, an erector-set-like suite of Cartesian motion components, controllers, and robotic functionality modules. Purpose-built robotics allows machine builders to add value by implementing exactly the robotic form and function that they require. Let's see how many of these we see!
Shopworn Terms
Every show has a word or two that gets over used to the point of diluting the meaning for everyone. Here are a couple of my bets for words that will be thrown around too freely:
Mechatronics: The synergistic application of electrical engineering, mechanical engineering, controls engineering and computer science to create useful products.
Sustainability: Meeting the needs of the present without compromising the ability of future generations to meet their own needs. Built on the pillars of social, environmental and economic impact.
Both are important concepts growing out of the intersection of technologies and ideas, where innovation is most likely to occur. But don't be drawn in by the mere use of the word, test to see that the ideas behind it are really there.
Workforce
I expect to hear a lot about workforce issues. At Interpack, booths were set up where there seemed to be no other activity going on other than recruiting. Lots of exhibitors will be recruiting for technically skilled people.
Also, expect to see more activity in the education pavilion and listen for discussion and possibly announcements about new degrees and certifications that are under consideration by Purdue, Reading Area Community College, PMMI and others in areas such as mechatronics. Yours truly will be leading a conference session on Tuesday morning on the topic of Developing the Packaging Workforce of the Future.
Standards
It's time for the industry to start using standards. If we don't, we're going to continue to overspend by continually reinventing the same thing and struggle with our inability to manage complexity. The OMAC Packaging Workgroup, perhaps the only organization in North America that is focusing on this problem, has reached a milestone with the incorporation of the PackM/L state model into ISA Technical Report TR88.00.02-2008. Congratulations to the OMAC work teams in this accomplishment. Stop by the OMAC booth in the Grand Concourse booth C-65 to learn more about the OMAC guidelines. Hopefully we'll be seeing a lot more application in machines on the floor.
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| About Keith Campbell |
| Leaders learn from the past while
looking to the future - and bring both to bear on the here
and now. This is the philosophy that has steered Keith Campbell's
30+ years in manufacturing. It has worked for him in operations,
maintenance, engineering, R&D, education, consulting and
professional organizations--and now he's putting it to work
for you--taking you to the edge of his thoughts on packaging
operations. |
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